|
For more than 25 years Tec-Sem has been providing fully automated loading systems for high throughput process equipment. Over 500 Tec-Sem Equipment Front End Modules (EFEM) are installed worldwide. All systems ensure high throughput on minimum footprint.
WTS200: Wafer Transfer System
Tec-Sem's WTS200 includes the air-flow optimized transfer-system with an optional SMIF opener interface and it optimizes the utilization of the wet process tool.
Key Features and Advantages
- Fully automated wafer handling
- Modular and compact solution
- Contamination free with passive wafer-edge gripping
WPA200: Wet Process Automation
Tec-Sem's WPA200 includes the Transfer system with an optional Cassette Buffer and it improves the utilization of wet process tools.
Key Features and Advantages
- Fully automated wafer handling
- Lot-ID and lot tracking
- AGV, OHT compatible
WPA300c: 300mm Wafer Transfer & Buffer System Compact EFEM for Batch-Process
Tec-Sem as pioneer in the 300mm batch process automation, delivered it's 1st system in 1996. During the past years the WPA300 evolved to it's current state and became an unbeatable automation system, providing our OEM customers with strong competitive advantages. The throughput of the WPA300c, compared to its predecessor, has been increased by almost 40% while its footprint has been reduced by more than 30%.
The WPA 300c is the trusted 3rd generation of a fully automated wet bench I/O that symbolizes a best in class product.
Tec-Sem's WPA300c includes the wafer transfer system with optional process-carrier buffer and are designed to optimize the utilization of the wet process tool with a minimum footprint.
Key Features and Advantages
- Ultra clean wafer handling
- Integrated FOUP buffer
- 2 independent FOUP load ports
- Lot-ID and lot tracking
- AGV and OHT compatible
Designed to automate your 3 up to 8 inch sputtering system with a vertical wafer loading system. Small footprint to automate cassette to cassette handling.
WLS 3-8'' Wafer Loading System
Designed to automate your 3 up to 8 inch sputtering system with a vertical wafer loading system. Small footprint to automate cassette to cassette handling.
Key Features and Advantages
- Contamination free with edge gripping
- Fault free handling and cassette positioning
- Wafer detection and counter
Single Wafer EFEM 300mm
Designed to automate your 300mm process equipment. Small footprint to automate single FOUP handling. Single wafer robot transfering wafers from the FOUP into your process tool.
Key Features and Advantages
- Contamination free with edge gripping
- Ultra-clean mini-environemnt
- Fault free wafer handling
- High accuracy of cassette positions
|
